Packaging technology of small pitch HD high resolution LED display screen
1. Table paste three in one (SMD)
Surface mount three in one (SMD) packaging is to weld single or multiple LED chips on the metal support with plastic “Cup” outer frame (the export of the support is respectively connected with the P and N levels of LED chips), and weld liquid epoxy resin in the plastic outer frame
2. New integrated packaging technology IMD (four in one).
Although the excellent color of LED display enterprises indicates that there is a profound technical precipitation in SMD chip processing technology, the “four in one” packaging is further developed on the basis of SMD packaging inheritance. SMD package contains one pixel in one package structure, and “four in one” package contains four pixels in one package structure. The four in one LED display adopts a new integrated packaging technology IMD (four in one), but its processing technology still adopts surface paste processing technology.
“Four in one” mini LED module IMD package integrates the advantages of SMD and cob, and deals with the branching, seam, light leakage, maintenance and other problems of ink color. It has the characteristics of high specific illumination, high integration, easy maintenance and low cost. At present, the “four in one” mini LED module adopts the formal chip for the original consideration, but as the packaging manufacturer puts forward more requirements for the chip, the planning scheme from “six in one” to “n one” will be further announced.
3. Cob packaging technology
LED display cob packaging means that after bonding the bare chip to the wiring substrate with conductive or non-conductive adhesive, stop the lead bonding and complete the electrical connection. Because cob packaging adopts integrated packaging technology and omits all LED devices, it adopts the processing technology of pasting sheets after packaging. Due to the reasonable handling of SMD packaged displays, the point spacing is sometimes reduced, so the processing technology is more difficult, the yield is reduced, and the cost is high. It is easier for cob to complete small spacing.