As people continue to pursue the ultimate visual experience, the demand for ultra high definition display is increasing, and LED display has entered the era of micro spacing. LED display has developed from monochrome to two-color, and then to full-color; the space between dots has been shrinking, from P30 to P20, P10, p2.5, and then to LED display below P1.
In this trend, the LED packaging technology also continues to progress, to the direction of diversification.
With the advent of ultra high definition display, N-in-One SMD emerges as the times require
As for the production of red (R), green (g) and blue (b) primary color chips in chromatics, they have been developing and progressing as early as 20 years ago, and the packaging methods of chips have become diversified, from dip packaging to SMD and cob packaging.
When the LED display screen is moving from outdoor to indoor, the chip size is developing to micron level with the miniaturization process. SMD surface packaging devices have been applied to indoor display screen, and the corresponding LED chip sizes are 3535, 2121, etc.
From 210 pixels to 1015 pixels, LED displays will be driven downward. There is little difference between p1.2-p2.5mm LED displays, and there is homogeneous competition.
With the arrival of 5g + 4K / 8K + AI era, the market needs more and more ultra high definition LED displays below P1. At this time, the size of LED chip below P1 is down to 0808 and 0606, and the packaging structure design is facing the challenges of process and yield, so the concept of N-in-One SMD comes into being.
For example, the four in one SMD uses the space of 1.5mm in length and width to divide four areas and package four red, green and blue chips at one time. N-in-One SMD has the opportunity to realize miniled display with smaller dot spacing without changing the surface mounted manufacturing mode.
N-in-One SMD package
N-in-One SMD package
SMD surface stickers have some limitations in small space display, such as electrostatic effect, bumping in the process of handling and installation is easy to damage the lamp beads, and the protection level is relatively weak.
Gob and AOB enhance protection function and enhance stability and reliability
In view of the limitations of SMD packaging technology, there are mainly gob and AOB solutions in the industry. Through surface treatment on the lamp board module, it can play the role of moisture-proof, dust-proof and anti-static, avoid the damage of lamp beads caused by bumping and scratching, and provide a strong guarantee for the stability and reliability of ultra high definition display.
